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Using the new Cypress Semiconductor/ Winbond VoIP headset demonstration kit! The new CY4638 VoIP Demonstration Kit combines Cypress’s low-power WirelessUSB™ LP (CYRF6936) 2.4-GHz radio system-on-chip and Winbond Electronics Corporation’s W681360 CODEC. This allows manufacturers an easily replicated, fast time-to-market design. The solutions offers a range over 20-meters.
The WirelessUSB LP headset board includes a Cypress Wireless enCoRe II flash microcontroller, a low power Winbond CODEC, and a rechargeable battery with the radio module. Winbond’s W681360 single-channel voice CODEC is a 13-bit linear analog-to-digital and digital-to-analog converter. The W681360 offers high performance voice quality at the lowest power consumption in the industry, directly impacting talk-time and battery life.
The CY4638 VoIP Headset Development Kit includes all of the following items:
- WirelessUSB LP Headset Board – Innovative dual antenna design for robustness. Uses Cypress WirelessUSB LP (CYRF6936), Wireless enCoRe II (CY7C60323) flash MCU and Winbond (W681360) 3V Single-Channel CODEC.
- WirelessUSB LP Bridge – Simple, small form-factor bridge. Uses WirelessUSB LP (CYRF6936) and enCoRe III (CY7C64215) USB flash MCU.
- WirelessUSB LP Demo Kit CD-ROM – Provides hardware schematics, bill of materials and firmware for Wireless VoIP headset design.
The CY4368 VoIP Demonstration kit is available now through Cypress Semiconductor. No MSRP or street price could be found.
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